SE97B_1
?NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 27 January 2010
2 of 53
NXP Semiconductors
SE97B
DDR memory module temp sensor with integrated SPD
2. Features
2.1 General features
JEDEC (JC-42.4) DIMM temperature sensor plus 256-byte serial EEPROM for Serial
Presence Detect (SPD)
SDA open-drain output design for best operation in distributed multi-point applications
Shutdown current: 0.1 糀 (typ.) and 5.0 糀 (max.)
Power-on reset: 1.8 V (typ.)
2-wire interface: I
2
C-bus/SMBus compatible, 0 Hz to 400 kHz
SMBus Alert Response Address and TIMEOUT 25 ms to 35 ms (programmable)
ESD protection exceeds 2500 V HBM per JESD22-A114, 250 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
Available in HWSON8 package
2.2 Temperature sensor features
11-bit ADC Temperature-to-Digital converter with 0.125 癈 resolution
Voltage range: 3.0 V to 3.6 V
Operating current: 250 糀 (typ.) and 400 糀 (max.)
Table 1.
Comparison of SE97 versus SE97B features
Feature
SE97
SE97B
JEDEC specification
old JEDEC specification
new JEDEC specification
Bit 8 1 Thermal Sensor shutdown
no SMBus Timeout
SMBus Timeout 25 ms to 35 ms
Bit 8 0 Thermal Sensor active
SMBus Timeout 25 ms to 35 ms
I
2
C-bus maximum frequency
400 kHz
I
2
C SCL and SDA V
IL
/V
IH
voltage levels
V
IL(max)
= 0.3 ?V
DD
; V
IH(min)
= 0.7 ?V
DD
Capabilities bit 6 SMBus Timeout
set to 0
set to 1
EVENT
pin operation
frozen
de-assert
Capabilities bit 7 EVENT
pin
set to 0
set to 1
A0 pin is 10 V tolerant
yes
Capabilities bit 5 VHV
set to 0
set to 1
I
2
C spike suppression
50 ns
I
2
C input hysteresis
-
0.05 ?V
DD
SE97 Device ID register
1010 0010
Revision ID register
0000 0001
0000 0011
Temperature Sensor accuracy
Grade B
Improved Grade B
Power-On Reset (POR)
0.6 V
1.8 V
Temperature Sensor voltage range
3.0 V to 3.6 V
EEPROM Write voltage range
3.0 V to 3.6 V
EEPROM Read voltage range
1.7 V to 3.6 V
3.0 V to 3.6 V
2 mm ?3 mm ?0.8 mm package
assembly plant Hong Kong
assembly plant Bangkok
(thicker die and leadframe)
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